Heat sink paste is a thermal compound used to ensure good contact between the integrated heat spreader (IHS) on a CPU and the metal heat sink, for optimal thermal transfer. It is also used to fill microscopic imperfections between the two surfaces, which inevitably contain air pockets that prevent the heat from dissipating properly.
When choosing a thermal paste, it’s important to consider its density/viscosity and electric conductivity. The higher these values, the better it will be at conducting heat. However, electrically conductive pastes can cause damage to components if accidentally spilled onto them, and can have adverse effects on the performance of a system by hindering its cooling capabilities.
Regardless of whether you’re looking for a high-performance thermal paste, or just one that will do the job well, Techspray offers a variety of options to suit your needs. Our products are available in both silicon and silicone-free formulas. Silicone thermal compounds can be a bit harder to work with than their silicone-free counterparts, and can be prone to migrating. These factors can affect solderability and conformal coating dewetting.
Before applying thermal paste, it’s a good idea to clean the area using isopropyl alcohol or a soft cloth/paper towel that doesn’t shed, and then let it dry completely before continuing. This is to ensure that no residue remains, which could interfere with the effectiveness of the new paste. In addition, it’s a good idea to consult your motherboard or cooler’s documentation for any specific instructions you may need to follow.